特点:

可节省人力及后焊之工时

 Saving labor and soldering time.

焊锡面之SMD零件，可省略点胶造成之生产不便，简化生产过程，提高生产效率;

No g I u i ng on the SMD components for cost sav i ng of non一gluing process and  increasing production efficiency.

减少基板因过锡燎而造成之变形及静电，优质的抗化学腐蚀性。

Keep PCB f I at&static under soldering process.Good chemical resistance  

应用:

 口适用于波峰焊、红外回流焊、电子组件自动、手动插装，SMD表面贴装，在线测试。

App I y to the PCB f I ow so I der i ng，infra一red  ref I ow，automatic&manual component insertion，surface mount p I acement，cleaning.